Developed in partnership with Qualcomm
with special thanks to Riko Radojcic
with special thanks to Riko Radojcic
Examples of 3D Path Finder capabilities
Simulation results for two selected nets.
Two 3D nets selected in 3D design.
Easily generate complex PDNs.
Easily generate complex busses
.
- Import Verilog or 2D floorplan
- Specify/modify 3D floorplan
- View 3D connections via fly-lines or actual routes
- Quickly route complex 3D busses
- Extract and simulate specified 3D nets
- Powerful PDN (power distribution network) generation
3D View of 3 stacked die before TSV Placer
Three stacked die with connectivity displayed as flylines.3D View of 3 stacked die before TSV Placer
After TSV Placer: TSVs placed and connections made...
- Automatically finds "holes" for TSVs
- Automatically optimizes and places TSVs
- Shows 3D connectivity with flylines
- Exports TSV data back into your 2D tools
Micro Magic, Inc.
Fast Silicon Fast
MAX-View Layout Viewer
Built on MAX-3D, Micro Magic’s native 3D Layout Editor
The MAX-3D-Design Suite contains
everything necessary to plan and lay
out today’s complex wafer-stack and
interposer multi-technology designs.
MMI’s suite of 3D tools includes
DPC-SUE, MAX-3D,
MAX-3D TSV Placer, and
MAX-3D Path Finder.
- Load multiple chips in the same
or different technologies
- Manage multiple levels of hierarchy
and multiple tech files all
at the same time
- Edit and view today’s largest
designs
- Automatic Connectivity Tracing
through multiple levels
- Show 3D connectivity with flylines
- Use your existing 2D Tech files
- View Results in 3D
DPC-SUE to import designs from either
2D floorplanner or block-level
verilog; specify chip level, block size,
connectivity; and export floorplan to
MAX-3D.
MAX-3D for true 3-dimensional layout,
supporting multiple distinct technology
files for Through-Si Via 3D wafer-stack
and interposer design.
or different technologies
and multiple tech files all
at the same time
designs
through multiple levels
2D floorplanner or block-level
verilog; specify chip level, block size,
connectivity; and export floorplan to
MAX-3D.
MAX-3D for true 3-dimensional layout,
supporting multiple distinct technology
files for Through-Si Via 3D wafer-stack
and interposer design.
MAX-3D Path Finder to explore viability of interposer or stacked-die implementations.
MAX-3D TSV Placer for automatically locating, optimizing and placing TSVs.
Micro Magic, Inc.
Fast Silicon Fast