Micro Magic, Inc. This 3-D TSV Placer tool automatically finds “holes” for TSVs, and automatically optimizes and places TSVs thru all wafers in the stack design. Click here for Full Information + Videos...
Use MAX 3-D Path Finder to explore viability of interposer or stacked-die implementations. View 3D connections via fly-lines or actual routes and quickly route complex 3D busses.Click for Full Information + Videos
Use MAX-3D Path Finder to analyze whether 3D is right for your project. MAX-3D PathFinder will then help determine the best partitioning.
Click for Full Information + VideosChip to Package to Board — Together or Independently Use MAX-3D System to view and analyze and edit chip, package and PC board all together in one tool, even in 3D. Click for complete information...
MAX System enables Chip-to-Package-to-Board Viewing and Editing, all together, in one tool.
MMI's technology allows you to iolate and extract nets and study signal integrity from chip, through package, across board, through another package, then to the receiving chip.
Click for complete information...Unique among 3D tools, the MAX Layout Family pioneers patented technology that allows each individual wafer to use its existing tech file without modification. Editing can be limited to a single wafer, or wafers can be edited in groups. Connectivity tracing can be done through individual or multiple wafers. Click for more info...
MAX-View Layout Viewer can load an display even the largest of chip designs, giving the designer the ability the really see the design and better grasp the project in its entirety. Finally, you'll be able to truly look at large, complex layouts. Click for complete info + videos...
Full-Featured True-3D Layout
Micro Magic's ground-breaking, production-proved layout tools provide the industry's only real three dimensional layout experience. Each wafer level maintains it's unique tech file, and can be edited individually, or collectively, as you choose. MMI's database can handle the largest of chips, and dispay layout and edits literally in real-time. On-board DRC checking, an easy-to-use and customizable interface, and cross-platform compatibility are just some of the many built-in, standardized features of the Micro Magic tool suite. Powerful enough to handle the largest of chips, yet easy enough to learn that designers can do real work the first day.
Incorporated in 1995, Micro Magic, Inc. is the industry leader in true 3-dimensional TSV layout tools. Click here for the full story
Engineers from Micro Magic meet with your engineers and management, to discuss the best solution to the problem or problems in the chip design. Some issues are smaller, and more easily remedied; some are larger and will require more involvement. Micro Magic's intention is to provide the most efficient solution utilizing your current design flow and our development tools. Our engineers can either do the work off-site, in house, or provide the MMI tool(s) and advice for a plug-n-play augmentation to your existing flow.
Trying to achieve the performance we needed from commercially-available tools just wasn't working. Over the course of several years, Micro Magic's engineers wound up writing their own tools to help get chips out. Our design services history is unmatched for making tapeout on time. Of course, our clients began to notice that MMI engineers were more efficient, more productive, and started asking about the tools. We responded by making them available to other engineers,and in 1995 the first versions of MAX and SUE were ready for the public..
Micro Magic, Inc.
Sunnyvale, CA
408.414.7647 x202
info at micromagic.com.
