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MAX-3D Path Finder

Quick Scenarios for 3D Evaluation

MAX-3D Path Finder is the tool you'll want when evaluating a new proposal: Is 3D TSV needed for this scenario?

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Video demonstration: (50 s)
Two chips on interposer, automatically generating complex busses, with selection of multiple nets, extraction of RC parasitics, and simulation results.

With MAX-3D Path Finder, it's now possible to explore viability of interposer or stacked-die implementations. Do multiple “what-if” studies on many different partitions, and export data for power analysis, timing analysis, parasitic extraction and simulation.

For example, this video clip (below) demonstrates how fast and easy it is to modify block placement and position.

Video demonstration: (45 s)
Modifying Blocks: Modify chip level and specify input data for blocks; modify size/spacing; move blocks and flylines follow. In 3D.

At right, a composite of two screenshots from the following videos, show Path Finder used to generate complex busses, and the automatic generation of PDN (Power Distribution Network).

View the videos for real-time examples of generating busses and automatic generation of a power distribution network.

Path Finder busses, PDN;
Automatic generation of complex busses and PDN

Video demonstration: (27 s)
The automatic generation of a complex bus, in 3D.

Video demonstration: (38 s)
Automatic generation of PDN (power distribution network) in 3D.

MAX-3D Path Finder

  • Does 3D work for you? MAX-3D Path Finder can help you answer this question.
  • Import Verilog or 2D floorplan
  • Specify/modify 3D floorplan
  • View 3D connections via fly-lines or actual routes
  • Quickly route complex 3D busses.
  • Extract and simulate specified 3D nets
  • Automatic PDN (power distribution network) generation
  • Use MAX-3D Path Finder to analyze whether 3D is right for your project. Then, MAX-3D Path Finder will help determine the best partitioning

3D Pathfinder, along with 3D TSV Placer, is part of Micro Magic's 3D Design Suite

  • About MMI

    Incorporated in 1995, Micro Magic, Inc. is the industry leader in true 3-dimensional TSV layout tools. Click here for the full story

  • How We Work

    Engineers from Micro Magic meet with your engineers and management, to discuss the best solution to the problem or problems in the chip design. Some issues are smaller, and more easily remedied; some are larger and will require more involvement. Micro Magic's intention is to provide the most efficient solution utilizing your current design flow and our development tools. Our engineers can either do the work off-site, in house, or provide the MMI tool(s) and advice for a plug-n-play augmentation to your existing flow.

  • Points of Interest

    Trying to achieve the performance we needed from commercially-available tools just wasn't working. Over the course of several years, Micro Magic's engineers wound up writing their own tools to help get chips out. Our design services history is unmatched for making tapeout on time. Of course, our clients began to notice that MMI engineers were more efficient, more productive, and started asking about the tools. We responded by making them available to other engineers,and in 1995 the first versions of MAX and SUE were ready for the public..

  • Contact Us

    Micro Magic, Inc.
    Sunnyvale, CA
    408.414.7647 x202
    info at micromagic.com.

 
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