MMI Logo Micro Magic, Inc.

3D Design Suite: 3D Tools for 3D Designs

Built on MAX-3D, Micro Magic’s native 3D Layout Editor

MAX-3D System / TSV Placer / MAX-3D Path Finder / DPC-SUE

The MAX-3D-Design Suite contains everything necessary to plan and lay out today’s complex wafer-stack and interposer multi-technology designs.

MAX-3D System:
Chip / Package / Board all together
MAX-3D Syster chip-package
Finally, View, Analyze and Edit Chip, Package and Board all in one tool

Finally! for the first time - your chips, package and PC board all together, in one tool. View, analyze, & edit all of them in one environment.

Click here for complete information...
MAX-3D TSV Placer
Video: TSV Placement (1 min)
Re-optimization of TSVs from outside of layout to center after modifying placement of 2 blocks

MAX-3D TSV Placer is a simple-to-use, powerful tool for automatic TSV location, optimization and placement.

Click here for complete information + videos...

MAX-3D Path Finder
Video demonstration: (45 s)
Modifying Blocks: Modify chip level and specify input data for blocks; modify size/spacing; move blocks and flylines follow. In 3D.

Using MAX-3D Path Finder it's now possible to explore viability of interposer or stacked-die implementations to evaluate potential TSV designs. Do multiple “what-if” studies on many different partitions, and export data for power analysis, timing analysis, parasitic extraction and simulation.

Click here for complete information + videos...
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Micro Magic's
Suite of 3D tools includes:

Click links above for complete information + videos.

“Tezzaron has taped out over 100 3D chips using MMI’s MAX-3D tool suite. There’s nothing to compare, and the new TSV placer & MAX-3D Path Finder are incredible.”
Robert Patti
VP, CTO
Tezzaron Semiconductor

 

“This is one of the few tools that can deal with multiple levels of hierarchy and multiple tech fi les all at the same time, and it is awesome for visualization of complex things like, say, PDN mesh across multiple die and interposers. Fantastic! I like it!”
Riko Radojcic
Director of Design for Silicon Initiatives
Qualcomm

  • About MMI

    Incorporated in 1995, Micro Magic, Inc. is the industry leader in true 3-dimensional TSV layout tools. Click here for the full story

  • How We Work

    Engineers from Micro Magic meet with your engineers and management, to discuss the best solution to the problem or problems in the chip design. Some issues are smaller, and more easily remedied; some are larger and will require more involvement. Micro Magic's intention is to provide the most efficient solution utilizing your current design flow and our development tools. Our engineers can either do the work off-site, in house, or provide the MMI tool(s) and advice for a plug-n-play augmentation to your existing flow.

  • Points of Interest

    Trying to achieve the performance we needed from commercially-available tools just wasn't working. Over the course of several years, Micro Magic's engineers wound up writing their own tools to help get chips out. Our design services history is unmatched for making tapeout on time. Of course, our clients began to notice that MMI engineers were more efficient, more productive, and started asking about the tools. We responded by making them available to other engineers,and in 1995 the first versions of MAX and SUE were ready for the public..

  • Contact Us

    Micro Magic, Inc.
    Sunnyvale, CA
    408.414.7647 x202
    info at micromagic.com.

 
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