Micro Magic, Inc. MAX-3D TSV Placer
Auto TSV Placement
MAX-3D TSV Placer is a simple-to-use, powerful tool for automatic TSV location, optimization and placement.
Video demonstration: (50 s)
In this real-time example, TSV Placer is run on a layout, resulting in all TSVs being positioned on the outside edges. Modifying the position of two chips, then re-running TSV placer, you notice the TSVs are now placed in a row in the center.
In the following video clip, blocks are placed on 3 stacked die, with connectivity shown via fly-lines. A simple menu-click automatically places the TSVs for all three die at once.
Video demonstration: (50 s)
3D floorplan: Connectivity for 3 stacked die; automatic TSV placement with demonstration of a blocking region leading to TSV shift, and routed connections.
At right, a view of "before-and-after", clearly showing the TSV placement for 2 chip levels.
Right, below, is the three-dimensional view of the TSV placement. All Micro Magic tools provide this 3D layout view.
The real-time video clip, below, demonstrates automatic placement of TSVs on a design with three chip levels.
screen shots courtesy Tezzaron
Video demonstration: (33 s)
Blocks on 3 stacked die with connectivity fly-lines; subsequent menu-click for TSV placement, displayed in 3D.
Once TSVs have been placed, the placement data can be exported back to your 2D tools and integrated into your design flow.