TSV 3D-FLOORPLANNER

Micro Magic, Inc. is pleased to announce
an important new tool for 3D TSV chip design:
3D-Floorplanner

Built on MAX-3D, Micro Magic's native 3D Layout Editor, 3D-Floorplanner:

• Loads multiple chips in the same or different technologies
• Automatically finds "holes" for TSVs
• Automatically optimizes and places TSVs
• Shows 3D connectivity with fly-lines in 3D-view
• Exports TSV data back into your 2D tools.

3D-Floorplanner is available for demonstration
Call 408 414 7647 or email "info"
for an appointment.