 |
MAX-3D
is the world’s first true 3D aware layout editor.
MAX-3D can combine distinct process wafers,
and allows the designer to view, edit and connect the independent wafers
into one 3D stack chip.
This design technique – known as “Through-Si
Via Wafer Stacking” – is a new dimension for chip designs. It allows
distinct wafers to be stacked on each other, and connected internally
(see diagram). This results in chips with denser designs and higher
performance.
For example, a processor design in a
32 nm technology could be combined with a 65 nm memory and a 180 nm
Analog device – on the same 3D chip. Furthermore, no changes need
to be made to the foundry-supplied PDKs to incorporate these technologies
in MAX-3D.
MAX-3D is the only commercial layout
editor capable of Through-Si Via 3D design. It includes connectivity
tracing, DRC checking and many other features found in Micro Magic’s
production-proven MAX layout editor.
The product and its underlying technology
have been in development for several years by one of the industry’s
leading experts – Dr Lisa McIlrath – Micro Magic’s Chief Scientist.
“I was impressed that MAX was able to provide the required speed and
capacity required for these large complex 3D designs” stated Dr McIlrath.
Through-Si Via 3D wafer stack designs
are an extreme challenge for design tools. Current large 2D designs
can crash many of today’s layout editors. A 3D chip which connects
several levels of 2D layouts multiplies the complexity of the design.
MAX-3D has demonstrated its capacity by displaying and editing a design
of 1.2 Trillion devices – in real time.
Like all Micro Magic products, MAX-3D
is fully programmable and customizable, and integrates well with other
EDA tools.
MAX-3D will be demonstrated at the RTI
Ventures 3D Architectures for Semiconductor Integration and Packaging
Conference to be held in Burlingame, CA October 22, 2007. Dr. McIlrath
will be presenting a seminar on 3D integrated circuit design at the
pre-conference symposium.
Robert Patti, CTO of Tezzaron Semiconductor
and a leading expert in 3D chip design, will also present at the 3D
Architectures conference. Mr Patti stated “MAX-3D is the world’s
first true 3D layout editor. It can handle our biggest designs. It’s
the fastest, easiest to use layout editor I’ve seen.”
MAX-3D is available for a 30 day trial
to qualified IC design organizations. For more information, Call 408-414-7647
or visit
http://www.micromagic.com/max-3d.html
- end - |
This example shows that different technologies can be combined in one 3D chip.
In this case, a processor is combined with a memory and an analog device.
Actual screenshot of Micro Magic's MAX-3D Layout Editor.
Example 3D Chip showing three wafer levels connected by through-Si vias.
Through-Si vias provide the highest level of performance. |
About
Micro Magic, Inc.
Micro Magic, Inc., provides tools, services,
and intellectual property (IP) for the design of high-speed, low-power
SoCs. The company’s mission is to help designers dramatically reduce
the time and cost required to produce high-performance SoC designs.
Micro Magic’s advanced EDA tools are built by IC designers for IC
designers. They can handle any size design, are production-proven, and
are easy to learn. The company’s products have been used to design
the datapaths and memory subsystems associated with all types of SoCs,
including processors, DSPs, embedded controllers, multi-media, network
and graphics chips.
|