Finally - Chips / Package / Board Unified
MAX-3D System is the first tool capable of loading, analyzing and editing all components of a 3D-TSV wafer stack design.
Using one environment, you can now really visualize and modify the project as an entity, without piecing aspects together from many disparate sources. Unification of the process speeds design efficiency and reduces the potential for error. The following video clips, taken real-time, show just a small portion of the capabilities of MAX-3D System.
MAX-3D System enables designers to view, analyze and edit across all parts in one tool, together, or individually. Separate technology files are maintained for each layer. Now, you are able to isolate and extract nets and study signal integrity across all components at the same time.
Below are close-up images of 3D-MAX System. In the upper image, the chip and package layers are visible.
In the lower image, several nets have been selected, showing their placement from the chip levels up through the package layer.